IEC Plug Specification

Type C (Europlug / CEE 7/16)

Ungrounded 2-prong plug with two round pins. The most widely used international plug, accepted across Continental Europe, parts of Asia, and South America.

Direct Specification Summary
Type C is an unearthed (ungrounded) electrical plug standard rated for 2.5A maximum amperage and typical voltages of 220–240V. Sockets are engineered with Two round pins, 4.0 mm diameter, 19 mm long, 19 mm pin center spacing.
Standard Property Technical Specification
Standard Designation Type C (Europlug / CEE 7/16)
Grounding / Earthing No (Unearthed / Double-insulated only)
Pin Count & Geometry 2 Pins — Two round pins, 4.0 mm diameter, 19 mm long, 19 mm pin center spacing
Maximum Current Rating 2.5A
Nominal Voltage Range 220–240V
Grounding Status
Ungrounded
2 Pins • 2.5A Maximum
Typical Voltage Range
220–240V
Physical: Two round pins, 4.0 mm diameter, 19 mm long, 19 mm pin center spacing

Countries & Territories Using Type C

Type C is officially deployed in the national grid or hotel accommodations of the following countries:

France (230V) Germany (230V) Italy (230V) Spain (230V) Switzerland (230V) Netherlands (230V) China (220V) India (230V) Thailand (220V) South Korea (220V) Indonesia (Bali) (230V) Brazil (127V) South Africa (230V) Greece (230V) Portugal (230V) Iceland (230V) Denmark (230V) Sweden (230V) Norway (230V) Vietnam (220V) Philippines (220V) Argentina (220V) Chile (220V) Turkey (230V) Egypt (220V) Israel (230V) Austria (230V) Belgium (230V) Poland (230V) Czech Republic (230V) Hungary (230V) Peru (220V) Morocco (220V)

Physical Pin Architecture & Safety Characteristics

The mechanical architecture of Type C is defined by Two round pins, 4.0 mm diameter, 19 mm long, 19 mm pin center spacing. Sockets engineered for this standard operate at nominal capacities up to 2.5A.

When traveling with equipment utilizing this plug, verify that the foreign receptacle is compatible with its physical grounding structure. Using 3-to-2 prong grounding cheater adapters can remove protective earth bonding, exposing metallic device housings to live chassis fault risks.

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